Tungsten Products

  Molybdenum Products

  Tungsten Electrodes

  Heat Sinks of Electronic     Packaging



    Tungsten Copper       Composite(WCu)

    Molybdenum Copper



    Glid Copper

    Oxygen-free Copper(OFC)

    Low CTE Alloys
Current Position: Home >> Products >> Heat Sinks >> Molybdenum (Mo)   (Click on the small picture to enlarge)
Product Brief Introduction:
Molybdenum is similar to Tungsten, with melting point of 2,620 ℃(4,753oF), a little lower than tungsten. The elongation ability is better than Tungsten, and it is easier to make the thin wires and thin foils.

It has the lowest coefficient of thermal expansion (CTE) of any pure metals, its CTE matches well with semiconductor materials, such as, Si, GaN, GaAs, Al2O3.

Product Properties:
Density: 10.2g/cm3
Melting Poing: 2620 ℃
CTE (20-2000℃): 4.9μm.m-1.k-1
Thermal Conductivity: 138 W.m.m-1.k-1

Similar applications with Tungsten。

ATTL Advanced Materials Co., Ltd.  Copyright ©2017  All Rights Reserved   SiteMaps
Tel: 0086-22-59213388(ext. 681,682,684,688) Fax: 0086-22-59215599 Email: sales@attl.cn attl@attl.cn  Website: www.attl.cn  www.74ryy.com

博盈彩票开户 人人红彩票平台 河北快3开奖 秒速赛车官网 吉林快3 868彩票 秒速赛车官网 极速3D彩票 秒速赛车官网 秒速赛车官网