Tungsten Products

  Molybdenum Products

  Tungsten Electrodes

  Heat Sinks of Electronic     Packaging

    Tungsten(W)

    Molybdenum(Mo)

   Tungsten Copper       Composite(WCu)

    Molybdenum Copper
      (Mo-Cu)

    Cu/Mo/Cu(CMC)

    Cu/MoCu/Cu(CPC)

    Glid Copper

    Oxygen-free Copper(OFC)

    Low CTE Alloys
Current Position: Home >> Products >> Heat Sinks >> Oxygen-free Copper (OFC)   (Click on the small picture to enlarge)
Product Brief Introduction:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts

Oxygen-free-copper (OFC): OFC copper is Copper with reduced oxygen level to increase the conductivity with typical oxygen content below 0.001%. It is wide used in the electronic industry. (See the table below for the properties of our OFC)
Product Properties:
Melting Point Softening Temperature g/cm3
Density at 20℃ 		Thermal conductivity
at 25℃		 Coefficient of thermal
expansion at 20℃
1083 ℃ 150 ℃ 8.93 391 17.7
 


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