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Current Position: Home >> Products >> Heat Sinks >> Cu/MoCu/Cu (CPC)   (Click on the small picture to enlarge)
Product Brief Introduction:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.

Features of Cu/Mo70Cu/Cu
□ Large sized sheets available (length up to XXmm, width up to XXmm)
□ More easily to be stamped into components than CMC
□ Very strong interface bonding which can repeatedly resist 850℃ heat shock
□ Higher thermal conductivity and lower cost
Product Properties:
Materials Density at 20℃ Coefficient of thermal expansion at 20℃ Thermal conductivity at 25 ℃
In - plane thru - thickness In - plane thru - thickness
1:4:1 9.4 7.2 9.0 340 300
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages,GaAs device mount.

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